Wafer scrubbing brush core

US6240588A · kind A · utility

Assignee

• Lam Research Corporation · US

Inventors

• Tanlin Dickey · Sunnyvale, US
• Julia Svirchevski · San Jose, US
• Donald Anderson · Locke, US
• Mike Ravkin · Sunnyvale, US
• Helmuth Treichel · Augsburg, DE
• Roy Winston Pascal · Union City, US
• Douglas Gardner · Milpitas, US

Key dates

• Filing date: Dec 3, 1999
• Grant date: Jun 5, 2001
• Expiry date: Dec 3, 2019

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B08B1/34
• WIPO field: Chemical engineering
• WIPO sector: Chemistry

Abstract

A brush core and the method for making a brush core for use in substrate scrubbing are provided. The substrate can be any substrate that may need to undergo a scrubbing operation to complete a cleaning operation, etching operation, or other preparation. For instance, the substrate can be a semiconductor wafer, a disk, or any other type of work piece that will benefit from a brush core that can deliver uniform controlled amounts of fluid through the brush along an entire length of the brush core. The brush core is defined by a tubular core having a length that extends between a first end and a second end. The first end has an opening into a bore that is defined through a middle of the tubular core and extends along an inner length of the tubular core. A first plurality of holes are oriented along a plurality of first lines that extend in the direction of the length of the tubular core, and each of the first plurality of holes define paths to the bore of the tubular core. A second plurality of holes are oriented along a plurality of second lines that extend in the direction of the length of the tubular core, and each of the second plurality of holes define paths to the core of the tu…