Layered lead structures
US6255723A · kind A · utility
16Cited by
18References
64Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1998 |
| Grant date | Jul 3, 2001 |
| Priority date | — |
| Expiry date | Oct 27, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01327
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.