Reliability testing method of dielectric thin film
US6269315A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 1999 |
| Grant date | Jul 31, 2001 |
| Priority date | — |
| Expiry date | Jan 14, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/129
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for testing the reliability of a dielectric thin film. An exponential current ramp test is performed with a delay time to test the dielectric thin film. An exponential current ramp charge-to-breakdown distribution, which is represented by cumulative distribution failure percentage, is obtained. An exponential current ramp charge-to-breakdown at a cumulative distribution failure percentage is calculated. An exponential current ramp constant and a constant current stress constant at the cumulative distribution failure percentage are calculated. A constant current stress charge-to-breakdown at the cumulative distribution failure percentage is calculated by using a specified current density and the constant current stress constant at the cumulative distribution failure percentage. The constant current stress charge-to-breakdown at the cumulative distribution failure percentage is compared to a specified constant current stress charge-to-breakdown to determine the reliability of the dielectric thin film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.