Flip FERAM cell and method to form same

US6333202A · kind A · utility

Assignee

• International Business Machines Corporation · US

Inventors

• James W. Adkisson · Jericho, US
• Charles T. Black · White Plains, US
• Alfred Grill · White Plains, US
• Randy W. Mann · Jericho, US
• Deborah A. Neumayer · Danbury, US
• Wilbur D. Pricer · Burlington, US
• Katherine L. Saenger · Ossining, US
• Thomas M. Shaw · Peekskill, US

Key dates

• Filing date: Aug 26, 1999
• Grant date: Dec 25, 2001
• Expiry date: Aug 26, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/977

Abstract

A method of forming an integrated ferroelectric/CMOS structure which effectively separates incompatible high temperature deposition and annealing processes is provided. The method of the present invention includes separately forming a CMOS structure and a ferroelectric delivery wafer. These separate structures are then brought into contact with each and the ferroelectric film of the delivery wafer is bonded to the upper conductive electrode layer of the CMOS structure by using a low temperature anneal step. A portion of the delivery wafer is then removed providing an integrated FE/CMOS structure wherein the ferroelectric capacitor is formed on top of the CMOS structure. The capacitor is in contact with the transistor of the CMOS structure through all the wiring levels of the CMOS structure.