Plasma assisted processing chamber with separate control of species density
US6352049B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 1998 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | Jul 20, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32871
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides an apparatus and method, for plasma assisted processing of a workpiece, which provides for separate control of species density within a processing plasma. The present invention has a processing chamber and at least one collateral chamber. The collateral chamber is capable of generating a collateral plasma and delivering it to the processing chamber. To control the densities of the particle species within the processing chamber the present invention may have: a filter interposed between the collateral chamber and the processing chamber, primary chamber source power, several collateral chambers providing separate inputs to the processing chamber, or combinations thereof. Collateral plasma may be: filtered, combined with primary chamber generated plasma, combined with another collateral plasma, or combinations thereof to separately control the densities of the species comprising the processing plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.