Film deposition using a finger type shadow frame
US6355108B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1999 |
| Grant date | Mar 12, 2002 |
| Priority date | — |
| Expiry date | Jun 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32623
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates generally to a clamping and alignment assembly for a substrate processing system. The clamping and aligning assembly generally includes a shadow frame, a floating plasma shield and a plurality of insulating alignment pins. The shadow frame comprises a plurality of tabs extending inwardly therefrom and is shaped to accommodate a substrate. The tabs comprise protruding contact surfaces for stabilizing a substrate on a support member during processing. The insulating alignment pins are disposed at a perimeter of a movable support member and cooperate with an alignment recess formed in the shadow frame to urge the shadow frame into a desired position. Preferably, the floating plasma shield is disposed on the insulating alignment pins in spaced relationship between the support member and the shadow frame to shield the perimeter of the support member during processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.