Coils for generating a plasma and for sputtering
US6368469B1 · kind B1 · utility
28Cited by
63References
54Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 1997 |
| Grant date | Apr 9, 2002 |
| Priority date | — |
| Expiry date | May 6, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3402
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.