Selective treatment of the surface of a microelectronic workpiece

US6413436B1 · kind B1 · utility

Assignee

• Semitool, Inc. · US

Inventors

• Brian Aegerter · Kalispell, US
• Curt Dundas · Kalispell, US
• Michael Jolley · Beaverton, US
• Tom Ritzdorf · Lolo, US
• Steven L. Peace · Whitefish, US
• Gary L. Curtis · Kila, US
• Raymon F. Thompson · Kalispell, US

Key dates

• Filing date: Nov 10, 1999
• Grant date: Jul 2, 2002
• Expiry date: Nov 10, 2019

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/963
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a process for treating a workpiece such as a semiconductor wafer, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or back sides of the workpiece. Exclusion and/or application of the processing fluid occurs by applying one or more processing fluids to the workpiece while the workpiece and a reactor holding the workpiece are spinning. The flow rate of the processing fluids, fluid pressure, and/or spin rate are used to control the extent to which the processing fluid is selectively applied or excluded from the outer peripheral margin.