Directing a flow of gas in a substrate processing chamber

US6450117B1 · kind B1 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Laxman Murugesh · Fremont, US
• Padmanaban Krishnaraj · San Francisco, US
• Michael S. Cox · Gilroy, US
• Canfeng Lai · Fremont, US
• Narendra Dubey · San Francisco, US
• Tom K. Cho · Palo Alto, US
• Sudhir Gondhalekar · Pleasanton, US
• Lily Pang · Fremont, US

Key dates

• Filing date: Aug 7, 2000
• Grant date: Sep 17, 2002
• Expiry date: Aug 7, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S438/905
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A substrate processing chamber 30 comprising a first gas distributor 65 adapted to provide a process gas into the chamber 30 to process the substrate 25, a second gas distributor 215 adapted to provide a cleaning gas into the chamber 30 to clean the chamber, and an exhaust 90 to exhaust the process gas or cleaning gas from the chamber 30.