Patent · US Expired

Method and apparatus for reducing thermal gradients within a substrate support

US6469283B1 · kind B1 · utility

69Cited by
13References
16Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 4, 1999
Grant dateOct 22, 2002
Priority date
Expiry dateMay 18, 2019

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/67103
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method and apparatus for reducing the thermal gradients within substrate support such as a ceramic wafer support pedestal. Specifically, the present invention is a heater controller that limits the amount of power that is applied to a resistive heater embedded within a ceramic pedestal. The heater controller comprises the necessary circuitry for limiting the amount of power applied to one or more zones with respect to a single other zone. Said heater controller also contains the necessary circuitry to detect faulty or misconnected wires between heater controller and the zones to be heated.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.