Optical view port for chemical mechanical planarization endpoint detection
US6488568B1 · kind B1 · utility
18Cited by
12References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2000 |
| Grant date | Dec 3, 2002 |
| Priority date | — |
| Expiry date | Jan 20, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D7/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An optical endpoint system for a CMP system with a viewport located off-center on the platen, said view port being adjustable in height so that the window of the viewport can be made flush with the top of the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.