Electrostatic chuck bonded to base with a bond layer and method

US6490146B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• You Wang · Cupertino, US
• Shamouil Shamouilian · San Jose, US
• Arnold Kholodenko · San Francisco, US
• Alexander Veytser · Mountain View, US
• Surinder Bedi · Fremont, US
• Kadthala Ramaya Narendrnath · San Jose, US
• Semyon L. Kats · San Francisco, US
• Dennis S. Grimard · Ann Arbor, US
• Wing Cheng · Sunnyvale, US
• Ananda H. Kumar · Fremont, US

Key dates

• Filing date: Aug 13, 2001
• Grant date: Dec 3, 2002
• Expiry date: Aug 13, 2021

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C04B2237/74
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

An electrostatic chuck for holding a substrate has an electrostatic member having a dielectric covering an electrode that is chargeable to electrostatically hold the substrate. The bond layer has a metal layer that is infiltrated or brazed between the electrostatic member and the base. The base may be a composite of a ceramic and metal, the composite having a coefficient of thermal expansion within about ±30% of a coefficient of thermal expansion of the electrostatic member. The base may also have a heater.