Low profile thick film heaters in multi-slot bake chamber

US6506994B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Yen-Kun Wang · Fremont, US
• Mark Fodor · Los Gatos, US
• Chen-An Chen · Sunnyvale, US
• Himanshu Pokharna · Santa Clara, US
• Son T. Nguyen · San Jose, US
• Kelly Fong · San Mateo, US
• Inna Shmurun · Foster City, US

Key dates

• Filing date: Jun 15, 2001
• Grant date: Jan 14, 2003
• Expiry date: Jun 15, 2021

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A heating chamber assembly for heating or maintaining the temperature of at least one wafer, employs thick film heater plates stacked at an appropriate distance to form a slot between each pair of adjacent heater plate surfaces. The heating chamber assembly may be employed adjacent one or more processing chambers to form a preheat station separate from the processing chambers, or may be incorporated in the load lock of one or more such processing chambers. The thick film heater plates are more efficient and have a better response time than conventional heat plates. A chamber surrounding the stack of heater plates is pressure sealable and nay include a purge gas inlet for supply purge gas thereto under pressure. A door to the chamber opens to allow wafers to be inserted or removed and forms a pressure seal upon closing. The slots in the stack are alignable with the door for loading and unloading of wafers. The stack is mounted on a drive shaft that extends through the chamber where it interfaces with a drive that traverses the drive shaft in and out of the chamber to align various slots as desired.