Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
US6517415B2 · kind B2 · utility
5Cited by
27References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/0053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.