Integrated circuits using optical fiber interconnects formed through a semiconductor wafer and methods for forming same
US6526191B1 · kind B1 · utility
63Cited by
46References
38Claims
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Assignee
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Key dates
| Filing date | Aug 21, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Aug 21, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit with a number of optical fibers that are formed in high aspect ratio holes. The high aspect ratio holes extend through a semiconductor wafer. The optical fibers include a cladding layer and a core formed in the high aspect ratio hole. These optical fibers are used to transmit signals between functional circuits on the semiconductor wafer and functional circuits on the back of the wafer or beneath the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.