Polymer and ceramic composite electronic substrates
US6528145B1 · kind B1 · utility
118Cited by
19References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Nov 11, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/259
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.