In-situ monitoring of linear substrate polishing operations
US6585563B1 · kind B1 · utility
29Cited by
34References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2000 |
| Grant date | Jul 1, 2003 |
| Priority date | — |
| Expiry date | Dec 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30625
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A substrate polishing scheme (apparatus and method) is described according to which a polishing surface of a polishing sheet is driven in a generally linear direction by a drive mechanism, a surface of a substrate is held against the polishing surface of the polishing sheet by a polishing head, and the substrate is probed through the polishing sheet by a monitoring system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.