Chemical-mechanical planarization of metallurgy

US6632377B1 · kind B1 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Vlasta Brusic · Amawalk, US
• Daniel C. Edelstein · White Plains, US
• Paul M. Feeney · South Burlington, US
• William L. Guthrie · Saratoga, US
• Mark A. Jaso · Yorktown Heights, US
• Frank B. Kaufman · Ossining, US
• Naftali E. Lustig · Ossining, US
• Peter D. Roper · Clinton Corners, US
• Kenneth P. Rodbell · Sandy Hook, US
• David B. Thompson · Sunnyvale, US

Key dates

• Filing date: Sep 30, 1999
• Grant date: Oct 14, 2003
• Expiry date: Sep 30, 2019

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/3212
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

Copper or a copper alloy is removed by chemical-mechanical planarization (CMP) in a slurry of an oxidizer, an oxidation inhibitor, and an additive that appreciably regulates copper complexing with the oxidation inhibitor.