Solution to metal re-deposition during substrate planarization
US6653242B1 · kind B1 · utility
18Cited by
62References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Nov 25, 2003 |
| Priority date | — |
| Expiry date | Feb 1, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09G1/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method and composition for planarizing a substrate. The composition includes one or more surfactants, including one or more anionic surfactants, Zweitter-ionic surfactants, dispersers, or combinations thereof, one or more chelating agents, one or more oxidizers, one or more corrosion inhibitors, and deionized water. The composition may further comprise one or more agents to adjust the pH and/or abrasive particles. The method comprises planarizing a substrate using a composition including one or more surfactants of anionic surfactants, Zweitter-ionic surfactants, or combinations thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.