Pad cleaning for a CMP system

US6669538B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Shijian Li · San Jose, US
• Ramin Emami · San Jose, US
• Sen-Hou Ko · Cupertino, US
• Shi-Ping Wang · Fremont, US
• Fred C. Redeker · Fremont, US
• Lizhong Sun · San Jose, US
• Stan Tsai · Clifton Park, US

Key dates

• Filing date: Feb 24, 2000
• Grant date: Dec 30, 2003
• Expiry date: Feb 24, 2020

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B24B53/017
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The present invention generally provides a system and apparatus for cleaning a polishing pad, such as a fixed abrasive pad, in a substrate processing system. In one embodiment, the system includes one or more nozzles which spray a fluid at pressures of about 30 psi to about 300 psi or greater, as measured at the nozzle, onto a polishing pad at acute angles to the surface of the polishing pad. The nozzles can spray downward and outward toward the perimeter of the pad to facilitate the debris removal therefrom. The system can include a pressure source to produce a sufficient fluid pressure substantially higher than the typical fluid pressure available from a facility installation.