Tantalum or tungsten target-copper alloy backing plate assembly and production method therefor
US6759143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2002 |
| Grant date | Jul 6, 2004 |
| Priority date | — |
| Expiry date | Jan 9, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12826
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tantalum or tungsten target-backing plate assembly which comprises a tantalum or tungsten target and a copper alloy backing plate that are subject to diffusion bonding via an aluminum- or aluminum alloy-sheet insert material at least 0.5 mm thick, and which is provided with diffusion bonded interfaces between the respective materials, wherein the assembly suffers only a small deformation after diffusion bonding and is free from separation between the target and the backing plate or from cracking even when the target material and the backing plate differ greatly in thermal expansion, and can survive high power sputtering; and a production method therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.