Coils for generating a plasma and for sputtering
US6783639B2 · kind B2 · utility
12Cited by
58References
32Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2002 |
| Grant date | Aug 31, 2004 |
| Priority date | — |
| Expiry date | May 12, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3402
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering coil for a plasma chamber in a semiconductor fabrication system is provided. The sputtering coil couples energy into a plasma and also provides a source of sputtering material to be sputtered onto a workpiece from the coil to supplement material being sputtered from a target onto the workpiece. Alternatively a plurality of coils may be provided, one primarily for coupling energy into the plasma and the other primarily for providing a supplemental source of sputtering material to be sputtered on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.