Wafer scrubbing device having brush assembly and mounting assembly forming spherical joint
US6820298B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2001 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jun 25, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/599
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A brush mounting system for a wafer scrubbing device includes a brush mandrel and a mounting assembly on which the brush mandrel is mounted. The mounting assembly includes a mounting member adapted to be mounted to a wall of the wafer scrubbing device, and a bearing secured to the mounting member. A brush support is rotatably mounted on the bearing and has an outer end that includes a contact surface adapted to contact the brush mandrel. The contact surface has a spherical profile. The brush mandrel includes a corresponding contact surface having a spherical profile, so that the brush mandrel and the mounting assembly form a spherical joint at the point of contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.