Temperature controlled dome-coil system for high power inductively coupled plasma systems
US6822185B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2002 |
| Grant date | Nov 23, 2004 |
| Priority date | — |
| Expiry date | Jan 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67109
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The temperature of a plasma chamber of a semiconductor fabrication tool is maintained substantially constant utilizing a variety of techniques, separately or in combination. One technique is to provide the exterior surface of the plasma chamber dome with a plurality of fins projecting into high velocity regions of an overlying airflow in order to dissipate heat from the chamber. Ducting defined by cover overlying the exposed exterior surface of the dome may also feature projecting lips or an airfoil to place high velocity components of the airflow into contact within the exterior dome surface and the fins. Other techniques include employing a high speed fan to control airflow circulation, and the use of temperature sensors in communication the fan through a processor to control fan speed and thereby regulate chamber temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.