Michael Welch
38Patents
21h-index
45Co-inventors
81Inventor score
Filing activity: Jun 1, 1994 → Jun 23, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6074514A | High selectivity etch using an external plasma discharge | Electricity | 478 | Expired |
| US5843847A | Method for etching dielectric layers with high selectivity and low microloading | Electricity | 270 | Expired |
| US5891350A | Adjusting DC bias voltage in plasma chambers | Electricity | 96 | Expired |
| US6232236A | Apparatus and method for controlling plasma uniformity in a semiconductor wafer processing system | Electricity | 84 | Expired |
| US6113731A | Magnetically-enhanced plasma chamber with non-uniform magnetic field | Electricity | 75 | Expired |
| US5740009A | Apparatus for improving wafer and chuck edge protection | Electricity | 73 | Expired |
| US5814563A | Method for etching dielectric using fluorohydrocarbon gas, NH.sub.3 -generating gas, and carbon-oxygen gas | Electricity | 66 | Expired |
| US5948168A | Distributed microwave plasma reactor for semiconductor processing | Emerging Cross-Sectional Technologies | 64 | Expired |
| US6432259B1 | Plasma reactor cooled ceiling with an array of thermally isolated plasma heated mini-gas distribution plates | Electricity | 57 | Expired |
| US6192827A | Double slit-valve doors for plasma processing | Emerging Cross-Sectional Technologies | 56 | Expired |
| US6284093A | Shield or ring surrounding semiconductor workpiece in plasma chamber | Emerging Cross-Sectional Technologies | 51 | Expired |
| US5702530A | Distributed microwave plasma reactor for semiconductor processing | Emerging Cross-Sectional Technologies | 50 | Expired |
| US6716302B2 | Dielectric etch chamber with expanded process window | Electricity | 48 | Expired |
| US6022446A | Shallow magnetic fields for generating circulating electrons to enhance plasma processing | Electricity | 42 | Expired |
| US5780359A | Polymer removal from top surfaces and sidewalls of a semiconductor wafer | Electricity | 40 | Expired |
| US6267549A | Dual independent robot blades with minimal offset | Electricity | 36 | Expired |
| US6797639B2 | Dielectric etch chamber with expanded process window | Electricity | 36 | Expired |
| US5865937A | Broad-band adjustable power ratio phase-inverting plasma reactor | Electricity | 33 | Expired |
| US6015761A | Microwave-activated etching of dielectric layers | Electricity | 32 | Expired |
| US6813534B2 | Endpoint detection in substrate fabrication processes | Electricity | 24 | Expired |
| US5400651A | Apparatus for interface measurement in a storage tank | Physics | 23 | Expired |
| US6689249B2 | Shield or ring surrounding semiconductor workpiece in plasma chamber | Emerging Cross-Sectional Technologies | 21 | Expired |
| US6592673B2 | Apparatus and method for detecting a presence or position of a substrate | Electricity | 18 | Expired |
| US6248206A | Apparatus for sidewall profile control during an etch process | Electricity | 17 | Expired |
| US6221782A | Adjusting DC bias voltage in plasma chamber | Electricity | 17 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.