Monitoring dimensions of features at different locations in the processing of substrates

US6829056B1 · kind B1 · utility

Inventors

• Michael Barnes · San Ramon, US
• John D. Holland, II · Scottsville, US
• Hongqing Shan · Cupertino, US
• Bryan Pu · San Jose, US
• Mohit Jain · Bengaluru, IN
• Zhifeng Sui · Fremont, US
• Michael D. Armacost · Winooski, US
• Neil E. Hanson · Santa Clara, US
• Diana Xiaobing Ma · Saratoga, US
• Ashok Sinha · Palo Alto, US
• Dan Maydan · Los Altos Hills, US

Key dates

• Filing date: Aug 21, 2003
• Grant date: Dec 7, 2004
• Expiry date: Aug 21, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67069
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A substrate processing apparatus has a chamber having a substrate support, gas distributor, gas energizer, and gas exhaust port. A process monitor is provided to monitor features in a first region of the substrate and generate a corresponding first signal, and to monitor features in a second region of the substrate and generate a second signal. A chamber controller receives and evaluates the first and second signals, and operates the chamber in relation to the signals. For example, the chamber controller can select a process recipe depending upon the signal values. The chamber controller can also set a process parameter at a first level in a first processing sector and at a second level in a second processing sector. The apparatus provides a closed control loop to independently monitor and control processing of features at different regions of the substrate.