Plasma processing apparatus and method
US6833051B2 · kind B2 · utility
23Cited by
23References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2002 |
| Grant date | Dec 21, 2004 |
| Priority date | — |
| Expiry date | May 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/321
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma processing apparatus includes a vacuum chamber having a structure that surrounds a space where plasma is generated, a sample stage disposed in the chamber on which a sample to be processed is placed and coil antenna providing an electric field to the space. The structure has a non-conductive member surrounding the space and a conductive member covering the non-conductive member, both of which are disposed between the antenna and the space. The conductive member is electrically floated at least when the plasma is generated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.