Fiber optic semiconductor analysis arrangement and method therefor
US6844928B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2001 |
| Grant date | Jan 18, 2005 |
| Priority date | — |
| Expiry date | Oct 15, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.