Patent · US Expired

Fiber optic semiconductor analysis arrangement and method therefor

US6844928B1 · kind B1 · utility

1Cited by
2References
19Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 19, 2001
Grant dateJan 18, 2005
Priority date
Expiry dateOct 15, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01N21/9501
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

The operability of light-based semiconductor die analysis is enhanced using a method and arrangement that directs light between a light source and a die. In one example embodiment of the present invention, a light source is directed to a die in a semiconductor analysis arrangement using a fiber optic cable. The analysis arrangement is adapted to use light received via the fiber optic cable to analyze the die. The analysis includes one or more light-based applications, such as stimulating a selected portion of the die with the light and detecting a response therefrom. In this manner, light can be directed to a die in a variety of analysis implementations, such as for analyzing a die in a test chamber.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.