Methods and apparatus for processing the surface of a microelectronic workpiece

US6869510B2 · kind B2 · utility

Assignee

• Semitool, Inc. · US

Inventors

• Daniel J. Woodruff · Kalispell, US
• Kyle M. Hanson · Kalispell, US
• Thomas H. Oberlitner · Kalispell, US
• Linlin Chen · Kalispell, US
• John M. Pedersen · Kalispell, US
• Vladimir Zila · Toronto, CA

Key dates

• Filing date: Oct 30, 2001
• Grant date: Mar 22, 2005
• Expiry date: Nov 18, 2022

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C25D17/06
• WIPO field: Pharmaceuticals
• WIPO sector: Chemistry

Abstract

A reactor for plating a metal onto a surface of a workpiece is set forth. The reactor comprises a reactor bowl including an electroplating solution disposed therein and an anode disposed in the reactor bowl in contact with the electroplating solution. A contact assembly is spaced from the anode within the reactor bowl. The contact assembly includes a plurality of contacts disposed to contact a peripheral edge of the surface of the workpiece to provide electroplating power to the surface of the workpiece. The contacts execute a wiping action against the surface of the workpiece as the workpiece is brought into engagement therewith The contact assembly also including a barrier disposed interior of the plurality of contacts. The barrier includes a member disposed to engage the surface of the workpiece to assist in isolating the plurality of contacts from the electroplating solution.