Method for removing electrolyte from electrical contacts and wafer touching areas

US6869516B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Dmitry Lubomirsky · Cupertino, US
• Michael Yang · Fremont, US
• Girish Dixit · San Jose, US
• Vincent E. Burkhart · Cupertino, US
• Allen L. D'Ambra · Burlingame, US
• Yeuk-Fai Edwin Mok · Santa Clara, US
• Harald Herchen · Los Altos, US

Key dates

• Filing date: Oct 18, 2002
• Grant date: Mar 22, 2005
• Expiry date: May 25, 2023

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/2885
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

A method for cleaning the electrical contact areas or substrate contact areas of an electrochemical plating contact ring is provided. Embodiments of the method include positioning a substrate on a substrate support member having one or more electrical contacts, chemically plating a metal layer on at least a portion of a surface of the substrate, removing the processed substrate from the support member, and cleaning the one or more electrical contacts with a vapor mixture comprising an alcohol. In another aspect, the method includes spraying the vapor mixture on the electrical contacts while rotating the substrate support member.