Apparatus for automatically positioning electronic dice within component packages

US6900459B2 · kind B2 · utility

Assignee

• Micron Technology, Inc. · US

Inventors

• Warren M. Farnworth · Nampa, US
• Alan G. Wood · Boise, US
• John O. Jacobson · Boise, US
• David R. Hembree · Boise, US
• James M. Wark · Boise, US
• Jennifer L. Folaron · Plano, US
• Robert Folaron · Plano, US
• Jay C. Nelson · Dallas, US
• Lelan D. Warren · Dallas, US

Key dates

• Filing date: Dec 5, 2002
• Grant date: May 31, 2005
• Expiry date: Dec 5, 2022

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/53178
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).