Systems and methods for simultaneous or sequential multi-perspective specimen defect inspection
US6922236B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 10, 2002 |
| Grant date | Jul 26, 2005 |
| Priority date | — |
| Expiry date | Aug 5, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/8825
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Systems and methods for inspecting a surface of a specimen such as a semiconductor wafer are provided. A system may include an illumination system configured to direct a first beam of light to a surface of the specimen at an oblique angle of incidence and to direct a second beam of light to a surface of the specimen at a substantially normal angle. The system may also include a collection system configured to collect at least a portion of the first and second beams of light returned from the surface of the specimen. In addition, the system may include a detection system. The detection system may be configured to process the collected portions of the first and second beams of light. In this manner, a presence of defects on the specimen may be detected from the collected portions of the first and second beams of light.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.