Substrate processing apparatus
US6951221B2 · kind B2 · utility
10Cited by
13References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 21, 2001 |
| Grant date | Oct 4, 2005 |
| Priority date | — |
| Expiry date | Jul 19, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The substrate processing apparatus is provided with a gas-liquid mixing nozzle for generating a process liquid mist by mixing a liquid and a pressurized gas, to discharge the process liquid mist to a substrate at high speeds. The liquid may be remover liquid, intermediate rinse liquid or deionized water. The reaction products which having been generated on the substrate in etching process is removed at high speeds with the flow of the mist, whereby the quality of the process is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.