Contact assemblies, methods for making contact assemblies, and machines with contact assemblies for electrochemical processing of microelectronic workpieces
US6962649B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2001 |
| Grant date | Nov 8, 2005 |
| Priority date | — |
| Expiry date | Jul 6, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D17/06
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Contact assemblies for electrochemical processing of microelectronic workpieces. The contact assemblies can comprise a support member that includes an inner wall which defines an opening configured to receive the workpiece and a plurality of contacts. The individual contacts include a conductor and a cover. The conductor can comprise a proximal section projecting inwardly into the opening relative to the support member, a distal section extending from the proximal section, and an inert exterior at least at the distal section. The cover comprises a dielectric element that covers at least the proximal section of the conductor, but does not cover at least a portion of the distal section of the core. The exposed portion of the distal section of the core, accordingly, defines a conductive contact site for contacting a conductive layer (e.g., a seed layer) on the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.