Semiconductor component with electromagnetic shielding device

US7009288B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Michael Bauer · Nittendorf, DE
• Christian Birzer · Burglengenfeld, DE
• Georg Ernst · Thalmässing, DE
• Rainer Steiner · Regensburg, DE
• Hermann Vilsmeier · Regensburg, DE
• Holger Woerner · Regensburg, DE

Key dates

• Filing date: Jul 13, 2004
• Grant date: Mar 7, 2006
• Expiry date: Jul 13, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor component with an electromagnetic shielding device against alpha radiation, beta radiation and high-frequency electromagnetic radiation is presented. The semiconductor component includes a semiconductor chip with a circuit integrated therein with a number of electrical terminal areas and at least one ground terminal area. The semiconductor also includes a package that contains the semiconductor chip and also a chip carrier. The chip carrier has a number of external electrical terminals and an external ground terminal. The electrical terminal areas and the ground terminal areas of the semiconductor chip are electrically connected to the external electrical terminals and the external ground terminals of the chip carrier by connecting means. The semiconductor chip and the connecting means are in this case encapsulated by an electrically insulating passivation. The semiconductor chip encapsulated in this way is in turn encapsulated with an electrically and thermally conductive plastics compound, which forms the package and is electrically connected to the ground terminal.