Method for recycling a substrate
US7022586B2 · kind B2 · utility
17Cited by
12References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 3, 2003 |
| Grant date | Apr 4, 2006 |
| Priority date | — |
| Expiry date | Feb 25, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76254
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a method for recycling a substrate that has a residue on its surface and a detachment profile resulting from an implantation process. The method includes removing the residue from the substrate to a level substantially equivalent to that of the detachment profile, thus obtaining a substantially uniform planar surface on the substrate, and then polishing the entire surface of the substrate to eliminate defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.