Integrated system for processing semiconductor wafers

US7059944B2 · kind B2 · utility

Assignee

• ASM Nutool, Inc. · US

Inventors

• Jalal Ashjaee · Cupertino, US
• Boris Govzman · Sunnyvale, US
• Bernard Frey · Livermore, US
• Boguslaw Nagorski · San Jose, US
• Douglas W. Young · Sunnyvale, US
• Bulent M. Basol · Manhattan Beach, US
• Homayoun Talieh · San Jose, US

Key dates

• Filing date: Feb 18, 2003
• Grant date: Jun 13, 2006
• Expiry date: Apr 6, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P90/02
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.