BOC BGA package for die with I-shaped bond pad layout
US7112048B2 · kind B2 · utility
2Cited by
30References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2003 |
| Grant date | Sep 26, 2006 |
| Priority date | — |
| Expiry date | Feb 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor die units for forming BOC BGA packages, methods of encapsulating a semiconductor die unit, a mold for use in the method, and resulting encapsulated packages are provided. In particular, the invention provides a semiconductor die unit comprising an integrated circuit die with a plurality of bond pads in an I-shaped layout and an overlying support substrate having an I-shaped wire bond slot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.