Inventor · Kirkland, WA, US

Victor Tan

36Patents
10h-index
53Co-inventors
78Inventor score

Filing activity: May 17, 2000 → Nov 1, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US6720666B2 BOC BGA package for die with I-shaped bond pad layout Electricity 81 Expired
US6692987B2 BOC BGA package for die with I-shaped bond pad layout Electricity 57 Expired
US7839419B2 Compositing desktop window manager Physics 49 Active
US7309623B2 Method of fabricating a stacked die in die BGA package Electricity 34 Active
US7302488B2 Parental controls customization and notification Physics 27 Expired
US7817163B2 Dynamic window anatomy Physics 21 Active
US6807666B1 Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment Physics 19 Expired
US7552391B2 Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment having remote nodes Physics 14 Expired
US7444735B2 Process for manufacturing an integrated circuit system Emerging Cross-Sectional Technologies 13 Active
US7282390B2 Stacked die-in-die BGA package with die having a recess Electricity 12 Expired
US7344969B2 Stacked die in die BGA package Electricity 8 Expired
US8059137B2 Compositing desktop window manager Physics 8 Active
US7332820B2 Stacked die in die BGA package Electricity 7 Expired
US7213054B2 Methods and apparatuses for handling single-user applications in multi-user computing environments Physics 7 Expired
US7332819B2 Stacked die in die BGA package Electricity 7 Expired
US8726042B2 Tamper resistant memory protection Physics 7 Active
US7770134B2 Methods and apparatuses for handling single-user applications in multi-user computing environments Physics 7 Active
US7371608B2 Method of fabricating a stacked die having a recess in a die BGA package Electricity 6 Expired
US8373277B2 Stacked die in die BGA package Electricity 4 Active
US7799610B2 Method of fabricating a stacked die having a recess in a die BGA package Electricity 4 Active
US7127719B2 Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment Physics 4 Expired
US7282392B2 Method of fabricating a stacked die in die BGA package Electricity 3 Active
US7358117B2 Stacked die in die BGA package Electricity 3 Active
US7575953B2 Stacked die with a recess in a die BGA package Electricity 3 Active
US7112048B2 BOC BGA package for die with I-shaped bond pad layout Electricity 2 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.