Thiam Chye Lim
20Patents
7h-index
23Co-inventors
65Inventor score
Filing activity: Feb 5, 2002 → Dec 27, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6720666B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 81 | Expired |
| US6692987B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 57 | Expired |
| US7309623B2 | Method of fabricating a stacked die in die BGA package | Electricity | 34 | Active |
| US7259451B2 | Invertible microfeature device packages | Electricity | 17 | Expired |
| US7282390B2 | Stacked die-in-die BGA package with die having a recess | Electricity | 12 | Expired |
| US9673183B2 | Methods of making semiconductor device packages and related semiconductor device packages | Electricity | 8 | Active |
| US7344969B2 | Stacked die in die BGA package | Electricity | 8 | Expired |
| US7332819B2 | Stacked die in die BGA package | Electricity | 7 | Expired |
| US7332820B2 | Stacked die in die BGA package | Electricity | 7 | Expired |
| US7371608B2 | Method of fabricating a stacked die having a recess in a die BGA package | Electricity | 6 | Expired |
| US8373277B2 | Stacked die in die BGA package | Electricity | 4 | Active |
| US7799610B2 | Method of fabricating a stacked die having a recess in a die BGA package | Electricity | 4 | Active |
| US7575953B2 | Stacked die with a recess in a die BGA package | Electricity | 3 | Active |
| US7358117B2 | Stacked die in die BGA package | Electricity | 3 | Active |
| US7282392B2 | Method of fabricating a stacked die in die BGA package | Electricity | 3 | Active |
| US7112048B2 | BOC BGA package for die with I-shaped bond pad layout | Electricity | 2 | Expired |
| US10937250B2 | Methods of reconstructing skulls | Physics | 1 | Active |
| US11282746B2 | Method of manufacturing microelectronic devices, related tools and apparatus | Electricity | 0 | Active |
| US9492279B2 | Bioabsorbable plug implants and method for bone tissue regeneration | Human Necessities | 0 | Active |
| US10115715B2 | Methods of making semiconductor device packages and related semiconductor device packages | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.