Tailored temperature uniformity
US7127367B2 · kind B2 · utility
22Cited by
41References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2004 |
| Grant date | Oct 24, 2006 |
| Priority date | — |
| Expiry date | Sep 24, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67103
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for obtaining a tailored heat transfer profile in a chamber housing a microprocessor manufacturing process, including estimating heat transfer properties of the chamber; estimating heat absorptive properties of a wafer; adjusting the physical characteristics of the chamber to correct the heat transfer properties; and utilizing the chamber for manufacturing microprocessors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.