Apparatus and method for depositing and planarizing thin films of semiconductor wafers
US7153400B2 · kind B2 · utility
17Cited by
57References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2003 |
| Grant date | Dec 26, 2006 |
| Priority date | — |
| Expiry date | Jun 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.