Dirk Efferenn
7Patents
2h-index
12Co-inventors
37Inventor score
Filing activity: Aug 27, 2002 → Nov 22, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7261829B2 | Method for masking a recess in a structure having a high aspect ratio | Electricity | 4 | Expired |
| US6770530B2 | Method for producing a shallow trench isolation for n- and p-channel field-effect transistors in a semiconductor module | Electricity | 4 | Expired |
| US7157381B2 | Method for providing whisker-free aluminum metal lines or aluminum alloy lines in integrated circuits | Electricity | 2 | Expired |
| US7413993B2 | Process for removing a residue from a metal structure on a semiconductor substrate | Electricity | 1 | Expired |
| US6964912B2 | Method for fabricating a semiconductor structure | Electricity | 0 | Expired |
| US6716720B2 | Method for filling depressions on a semiconductor wafer | Electricity | 0 | Expired |
| US7125778B2 | Method for fabricating a self-aligning mask | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.