Materials for chemical mechanical polishing
US7179159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 2, 2005 |
| Grant date | Feb 20, 2007 |
| Priority date | — |
| Expiry date | May 2, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D2203/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The polishing article may include various polygonal tiles and oval shapes formed in the polishing material which allow enhanced slurry retention and ease in rolling from a polishing material supply roll and onto a take-up roll in a web type platen assembly. The polishing article may also include an upper carrier film adapted to minimize delaminating stress placed in an area of the polishing article that is not adapted for polishing. A method and apparatus for manufacturing the various embodiments of the polishing article and a replacement supply roll are also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.