Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
US7202570B2 · kind B2 · utility
2Cited by
16References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Apr 10, 2007 |
| Priority date | — |
| Expiry date | Dec 1, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2848
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having a superior connection reliability is obtained by providing a buffer body for absorbing the difference of thermal expansion between the mounting substrate and the semiconductor element in a semiconductor package structure, even if an organic material is used for the mounting substrate. A film material is used as the body for buffering the thermal stress generated by the difference in thermal expansion between the mounting substrate and the semiconductor element. The film material has modulus of elasticity of at least 1 MPa in the reflow temperature range (200–250° C.).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.