Method and apparatus for reduced wear polishing pad conditioning

US7210988B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Yan Wang · Chongqing, CN
• Stan Tsai · Clifton Park, US
• Yongqi Hu · Campbell, US
• Feng Q. Liu · San Jose, US
• Liang-Yuh Chen · San Jose, US
• Daxin Mao · Cupertino, US
• Huyen Karen Tran · San Jose, US
• Martin S. Wohlert · San Jose, US
• Renhe Jia · Naperville, US
• Yuan Tian · Alameda, US

Key dates

• Filing date: Aug 22, 2005
• Grant date: May 1, 2007
• Expiry date: Aug 22, 2025

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B23H5/08
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head to a processing pad. The brush spins and moves laterally across the surface of the processing pad. The cleaning solution dispensed through the conditioning head dissolves by-products of the processing operation while the brush gently wipes the processing pad. A lip of the conditioning head retains the cleaning fluid and cleaning waste, thereby minimizing contamination of the area outside of the conditioning head. The cleaning waste is removed from the processing pad via passages formed near the outer periphery of the conditioning head.