CMP apparatus and method
US7229339B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2004 |
| Grant date | Jun 12, 2007 |
| Priority date | — |
| Expiry date | Jul 2, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/345
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces from the plurality of CMP systems, a plurality of cleaning stations for cleaning processed work pieces unloaded from the CMP systems, and a single robot configured to transfer unprocessed work pieces to the plurality of load cups and to transfer processed work pieces from the load cups to the plurality of cleaning stations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.