Method and apparatus for simultaneously cleaning the front side and back side of a wafer
US7231682B1 · kind B1 · utility
11Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2003 |
| Grant date | Jun 19, 2007 |
| Priority date | — |
| Expiry date | May 24, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67057
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for cleaning a semiconductor substrate is provided. The method initiates with transferring the semiconductor substrate into a chamber. Then, a first side of the semiconductor substrate is cleaned according to a first cleaning technique. A second side of the semiconductor substrate is simultaneously cleaned according to a second cleaning technique. The semiconductor substrate is then transferred from the chamber. A system and apparatus for simultaneously cleaning opposing sides of a semiconductor substrate are also provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.