Method and apparatus for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces

US7234477B2 · kind B2 · utility

Assignee

• Lam Research Corporation · US

Inventors

• John M. de Larios · Palo Alto, US
• Mike Ravkin · Sunnyvale, US
• Carl Woods · Capitola, US
• Fritz Redeker · Fremont, US
• James P. Garcia · Santa Clara, US
• Afshin Nickhou · Campbell, US

Key dates

• Filing date: Sep 30, 2002
• Grant date: Jun 26, 2007
• Expiry date: Nov 10, 2023

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

One of many embodiments of a substrate preparation system is provided which includes a head having a head surface where the head surface is proximate to a surface of the substrate. The system also includes a first conduit for delivering a first fluid to the surface of the substrate through the head, and a second conduit for delivering a second fluid to the surface of the substrate through the head, where the second fluid is different than the first fluid. The system also includes a third conduit for removing each of the first fluid and the second fluid from the surface of the substrate where the first conduit, the second conduit and the third conduit act substantially simultaneously.