Reworkable thermal interface material
US7253523B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 29, 2003 |
| Grant date | Aug 7, 2007 |
| Priority date | — |
| Expiry date | Feb 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process of making a reworkable thermal interface material is described. The reworkable thermal interface material is bonded to a die and a heat sink. The reworkable thermal interface material includes a phase-change polymer matrix material. Other materials in the reworkable thermal interface material can include heat transfer particles and low melting-point metal particles. The phase-change polymer matrix material includes a melting temperature below a selected temperature and the heat transfer particles have a melting temperature substantially above the selected temperature. The heat transfer particles act as a spacer limit, which holds the thermal interface material to a given bond-line thickness during use.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.